Drilling
- 7 mil Minimum Hole Size
- 4 mil Minimum Lines
- 4 mil Minimum Spacing
- Blind / Buried Vias
- Copper-Filled Vias
Materials
- R.O.H.S. Compliant (Lead Free Solder - E.N.I.G.)
- Multi-Layer Boards up to 14 Layers
- Board Thickness from .020 to .125
- Copper Weight from 0.5oz to 4oz
- Internal and External Heat Sinks
- Rigid-Flex Circuits
Testing
- Flying Probe
- Bare-board, Through-hole and Surface Mount Testing
- AOI (Automated Optical Inspection)
- Clamshell
- Bed of Nails
Assembly
- Double-Sided Surface Mount
- Through-hole
Film
- Dry Film Imaging
- Photo Plots at 2000 & 4000 dpi
Design
- Circuit Design
- PCB Layout
- Rapid Prototyping of Consumer-grade Electronics
Turn-Around
- As fast as 24 Hours for 2-4 Layer PCBs
